Antec® Formula 6 Thermal Compound

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Item # 901-FORMULA6
  Model # FORMULA 6
• Micronized Silver: No
100% of respondents would recommend this
$10.99 Total Price
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  • A diamond-caliber solution
  • Antec®'s Formula 6 thermal compound helps keep your CPU cool even when your rig is running on all cylinders
  • Built to perform optimally between extreme temperatures of -30°C to 250°C
  • Antec® Formula 6 thermal compound's diamond particles facilitate the transfer of heat between your CPU and heat sink, thus increasing your system's efficiency
  • Lighter, easier to spread and stable composition won't crack or dry out
  • Diamond particles measuring 0.0000015cm rated at 5.3w/mK
  • Quantity: 4g
  • Dimensions: 3Hx1.1Wx0.7"D
  • Got a question? Give us a call and we'll help! Call 1-800-789-1331.

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