Antec® Formula 7 Thermal Compound

A diamond-caliber solution Antec®'s Formula 7 thermal compound helps keep your CPU cool even when your CPU is running on all cylinders Composed to perform optimally between extreme temperatures of -50°C to 250°C Antec® Formula 7 thermal compound's diamond particles facilitate the transfer of heat between your CPU and heat sink, thus increasing your system's efficiency Lighter, easier to spread and stable composition won't crack or dry out Diamond particles measuring 0.0000015cm rated at 8.3w/mK Quantity: 4g Dimensions: 6.7Hx2.6Wx0.9"D Got a question? Give us a call and we'll help! Call 1-800-789-1331.

Technical Information

Micronized Silver :

No

Temperature Range :

-30C to 250C-50C to 250C

Thermal Conductivity :

8.3 w/mK

Thermal Resistance :

<0.0045 C-in2/w

Miscellaneous

Brand :

Antec Inc.

Country of Origin :

CHN

Weight

Weight :

0.10 lbs. per Each

Box Contents

The following items will be included with your purchase:

Formula 7 nano diamond thermal compound