Keeps your system cool and your CPU functioning comfortably.
- A diamond-caliber solution
- Antec®'s Formula 7 thermal compound helps keep your CPU cool even when your CPU is running on all cylinders
- Composed to perform optimally between extreme temperatures of -50°C to 250°C
- Antec® Formula 7 thermal compound's diamond particles facilitate the transfer of heat between your CPU and heat sink, thus increasing your system's efficiency
- Lighter, easier to spread and stable composition won't crack or dry out
- Diamond particles measuring 0.0000015cm rated at 8.3w/mK
- Quantity: 4g
- Dimensions: 6.7Hx2.6Wx0.9"D
- Got a question? Give us a call and we'll help! Call 1-800-789-1331.
- Technical Information
Micronized Silver :No
Temperature Range :-30C to 250C-50C to 250C
Thermal Conductivity :8.3 w/mK
Thermal Resistance :<0.0045 C-in2/w
Country of Origin :CHN
Brand :Antec Inc.
Weight :0.10 lbs. per Each
In The Box
The following items will be included with your purchase:
- Formula 7 nano diamond thermal compound