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Antec® Formula 7 Thermal Compound

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Item # 901-FORMULA7
  Model # FORMULA 7
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Antec® Formula 7 Thermal Compound
$14.99 /Each
 
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  • Micronized Silver: No
  • Brand: Antec Inc.
Description
  • A diamond-caliber solution
  • Antec®'s Formula 7 thermal compound helps keep your CPU cool even when your CPU is running on all cylinders
  • Composed to perform optimally between extreme temperatures of -50°C to 250°C
  • Antec® Formula 7 thermal compound's diamond particles facilitate the transfer of heat between your CPU and heat sink, thus increasing your system's efficiency
  • Lighter, easier to spread and stable composition won't crack or dry out
  • Diamond particles measuring 0.0000015cm rated at 8.3w/mK
  • Quantity: 4g
  • Dimensions: 6.7Hx2.6Wx0.9"D
  • Got a question? Give us a call and we'll help! Call 1-800-789-1331.
Specifications
Technical Information Micronized Silver : No Temperature Range : -30C to 250C-50C to 250C
Thermal Conductivity : 8.3 w/mK Thermal Resistance : <0.0045 C-in2/w
Miscellaneous Country of Origin : CHN Brand : Antec Inc.
Weight Weight : 0.10 lbs. per Each
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Box Contents
The following items will be included with your purchase:
  • Formula 7 nano diamond thermal compound

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